Early detection of the metallization quality using moderately accelerated electromigration stress conditions

A. Scorzoni, I. De Munari, M. Impronta, R. Balboni, N. Kelaidis, S. Foley, M. Forde

Research output: Chapter in Book/Report/Conference proceedingConference proceeding

4 Citations (Scopus)

Abstract

In this work we use a wafer-level, High Resolution Resistance Measuring Technique (HRRMT) to detect fabrication faults of Al-Cu interconnections. Experiments have been performed on two distinct sets of metal lines. The first set includes two lots of 4 μm wide lines which, once tested at moderately accelerated stress conditions, gave largely different life times. A microstructural analysis confirmed a major defect of the lot with shorter life time. An accurate examination of the early resistance variations revealed the presence of two distinct and subsequent phases, namely an initial pseudo-parabolic resistance increase followed by a linear resistance drop. Significant differences between the resistance behaviour of the two lots were detected during the first stage, lasting a few hours. Measurable differences could even be detected in the first few minutes. A second group of experiments was launched in order to assess the capability of HRRMT as in-line monitors. Samples from four wafers, one reference wafer and three wafers with intentional process variations, have been tested using our HRRMT at constant temperature and current, simulating an in-line production test. The standard life time of the four wafers have also been collected. Preliminary measurements highlight that a change of life time due to process variation corresponds to changes of the resistance behaviour in the first hours of test. These results pave the way for a new application of high resolution methods to assess the quality of a metallization system in a reasonable amount of time.

Original languageEnglish
Title of host publicationMaterials Research Society Symposium - Proceedings
EditorsJ.C. Bravman, T.N. Marieb, J.R. Lloyd, M.A. Korhonen
Place of PublicationWarrendale, US
PublisherMaterials Research Society
Pages15-25
Number of pages11
Volume516
DOIs
Publication statusPublished - Jan 1998
Externally publishedYes
Event1998 MRS Spring Meeting - San Francisco, United States
Duration: 13 Apr 199816 Apr 1998

Publication series

NameMaterials Research Society Symposium Proceedings
PublisherMaterials Research Society
Volume516
ISSN (Print)0272-9172

Conference

Conference1998 MRS Spring Meeting
CountryUnited States
CitySan Francisco
Period13/04/9816/04/98

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Scorzoni, A., De Munari, I., Impronta, M., Balboni, R., Kelaidis, N., Foley, S., & Forde, M. (1998). Early detection of the metallization quality using moderately accelerated electromigration stress conditions. In J. C. Bravman, T. N. Marieb, J. R. Lloyd, & M. A. Korhonen (Eds.), Materials Research Society Symposium - Proceedings (Vol. 516, pp. 15-25). (Materials Research Society Symposium Proceedings; Vol. 516). Warrendale, US: Materials Research Society. https://doi.org/10.1557/PROC-516-15