Dynamic thermal simulation of power devices operating with PWM signals

Z. Zhou, M. S. Khanniche, P. Igic, S. N. Jankovic, S. G. Batcup, P. A. Mawby

Research output: Chapter in Book/Report/Conference proceedingConference proceeding

Abstract

Fast power devices thermal simulation method based on averaging power losses over each cycle of PWM switching frequency is presented in this paper. For implementing a long real time dynamic thermal simulation of power devices, device power losses during transient process and static characteristics are defined as a function of device conduction current and junction temperature, and are represented by a lookup table. By carrying out the circuit electrical simulation, the device conduction current can be obtained. By combining the device conduction currents, global device temperature (GDT) and the data from the lookup table, the average power loss over each cycle of PWM switching frequency is then calculated for carrying out the thermal simulation. With the proposed method, a relative large simulation time step can be employed and simulation speed can be increased dramatically. The method is suitable for a long real time thermal simulation for complex power electronics systems.

Original languageEnglish
Title of host publication2006 25th International Conference on Microelectronics, MIEL 2006 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages193-196
Number of pages4
ISBN (Print)1424401178, 9781424401178
DOIs
Publication statusPublished - 10 Jul 2006
Externally publishedYes
Event2006 25th International Conference on Microelectronics, MIEL 2006 - Belgrade, Serbia
Duration: 14 May 200617 May 2006

Publication series

Name2006 25th International Conference on Microelectronics, MIEL 2006 - Proceedings

Conference

Conference2006 25th International Conference on Microelectronics, MIEL 2006
CountrySerbia
CityBelgrade
Period14/05/0617/05/06

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Zhou, Z., Khanniche, M. S., Igic, P., Jankovic, S. N., Batcup, S. G., & Mawby, P. A. (2006). Dynamic thermal simulation of power devices operating with PWM signals. In 2006 25th International Conference on Microelectronics, MIEL 2006 - Proceedings (pp. 193-196). [1650925] (2006 25th International Conference on Microelectronics, MIEL 2006 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICMEL.2006.1650925