Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured Components

Dibakor Bourah; Nele Dewagtere; Bilal Ahmad; Rafael Nunes; Jeroen Tacq; Xiang Zhang; Hua Guo; Wim Verlinde; Wim De Waele

doi:10.3390/ma16041702

Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured Components

Dibakor Bourah
, Nele Dewagtere
, Bilal Ahmad
, Rafael Nunes
, Jeroen Tacq
, Xiang Zhang
, Hua Guo
, Wim Verlinde
, Wim De Waele

Centre for Manufacturing and Materials

Ghent University
Belgian Welding Institute
Sirris

Research output: Contribution to journal › Article › peer-review

15 Citations (Scopus)

178 Downloads (Pure)

Abstract

This study aims to demonstrate the capability of the digital image correlation (DIC) technique for evaluating full-field residual stresses in wire and arc-additive-manufactured (WAAM) components. Investigations were carried out on WAAM steel parts (wall deposited on a substrate) with two different wall heights: 24 mm and 48 mm. Mild steel solid wire AWS ER70S-6 was used to print WAAM walls on substrates that were rigidly clamped to H-profiles. DIC was used to monitor the bending deformation of WAAM parts during unclamping from the H-profiles, and residual stresses were calculated from the strain field captured during unclamping. Residual stresses determined from the proposed DIC-based method were verified with an analytical model and validated by the results from established residual stress measurement techniques, i.e., the contour method and X-ray diffraction.

Original language	English
Article number	1702
Number of pages	19
Journal	Materials
Volume	16
Issue number	4
Early online date	17 Feb 2023
DOIs	https://doi.org/10.3390/ma16041702
Publication status	Published - Feb 2023

Bibliographical note

This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).

Keywords

additive manufacturing
contour method
digital image correlation
residual stresses
wire + arc additive manufacturing
X-ray diffraction

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10.3390/ma16041702Licence: CC BY

PublishedFinal published version, 9.73 MBLicence: CC BY

Cite this

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title = "Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured Components",

abstract = "This study aims to demonstrate the capability of the digital image correlation (DIC) technique for evaluating full-field residual stresses in wire and arc-additive-manufactured (WAAM) components. Investigations were carried out on WAAM steel parts (wall deposited on a substrate) with two different wall heights: 24 mm and 48 mm. Mild steel solid wire AWS ER70S-6 was used to print WAAM walls on substrates that were rigidly clamped to H-profiles. DIC was used to monitor the bending deformation of WAAM parts during unclamping from the H-profiles, and residual stresses were calculated from the strain field captured during unclamping. Residual stresses determined from the proposed DIC-based method were verified with an analytical model and validated by the results from established residual stress measurement techniques, i.e., the contour method and X-ray diffraction.",

keywords = "additive manufacturing, contour method, digital image correlation, residual stresses, wire + arc additive manufacturing, X-ray diffraction",

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AU - Bourah, Dibakor

AU - Dewagtere, Nele

AU - Ahmad, Bilal

AU - Nunes, Rafael

AU - Tacq, Jeroen

AU - Zhang, Xiang

AU - Guo, Hua

AU - Verlinde, Wim

AU - De Waele, Wim

N1 - This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).

PY - 2023/2

Y1 - 2023/2

N2 - This study aims to demonstrate the capability of the digital image correlation (DIC) technique for evaluating full-field residual stresses in wire and arc-additive-manufactured (WAAM) components. Investigations were carried out on WAAM steel parts (wall deposited on a substrate) with two different wall heights: 24 mm and 48 mm. Mild steel solid wire AWS ER70S-6 was used to print WAAM walls on substrates that were rigidly clamped to H-profiles. DIC was used to monitor the bending deformation of WAAM parts during unclamping from the H-profiles, and residual stresses were calculated from the strain field captured during unclamping. Residual stresses determined from the proposed DIC-based method were verified with an analytical model and validated by the results from established residual stress measurement techniques, i.e., the contour method and X-ray diffraction.

AB - This study aims to demonstrate the capability of the digital image correlation (DIC) technique for evaluating full-field residual stresses in wire and arc-additive-manufactured (WAAM) components. Investigations were carried out on WAAM steel parts (wall deposited on a substrate) with two different wall heights: 24 mm and 48 mm. Mild steel solid wire AWS ER70S-6 was used to print WAAM walls on substrates that were rigidly clamped to H-profiles. DIC was used to monitor the bending deformation of WAAM parts during unclamping from the H-profiles, and residual stresses were calculated from the strain field captured during unclamping. Residual stresses determined from the proposed DIC-based method were verified with an analytical model and validated by the results from established residual stress measurement techniques, i.e., the contour method and X-ray diffraction.

KW - additive manufacturing

KW - contour method

KW - digital image correlation

KW - residual stresses

KW - wire + arc additive manufacturing

KW - X-ray diffraction

UR - https://www.scopus.com/pages/publications/85149247498

U2 - 10.3390/ma16041702

DO - 10.3390/ma16041702

M3 - Article

SN - 1996-1944

VL - 16

JO - Materials

JF - Materials

IS - 4

M1 - 1702

ER -

Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured Components

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Keywords

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