Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured Components

Dibakor Bourah, Nele Dewagtere, Bilal Ahmad, Rafael Nunes, Jeroen Tacq, Xiang Zhang, Hua Guo, Wim Verlinde, Wim De Waele

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)
67 Downloads (Pure)

Abstract

This study aims to demonstrate the capability of the digital image correlation (DIC) technique for evaluating full-field residual stresses in wire and arc-additive-manufactured (WAAM) components. Investigations were carried out on WAAM steel parts (wall deposited on a substrate) with two different wall heights: 24 mm and 48 mm. Mild steel solid wire AWS ER70S-6 was used to print WAAM walls on substrates that were rigidly clamped to H-profiles. DIC was used to monitor the bending deformation of WAAM parts during unclamping from the H-profiles, and residual stresses were calculated from the strain field captured during unclamping. Residual stresses determined from the proposed DIC-based method were verified with an analytical model and validated by the results from established residual stress measurement techniques, i.e., the contour method and X-ray diffraction.
Original languageEnglish
Article number1702
Number of pages19
JournalMaterials
Volume16
Issue number4
Early online date17 Feb 2023
DOIs
Publication statusPublished - Feb 2023

Bibliographical note

This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).

Keywords

  • additive manufacturing
  • contour method
  • digital image correlation
  • residual stresses
  • wire + arc additive manufacturing
  • X-ray diffraction

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