Developing a novel binderless diamond grinding wheel with femtosecond laser ablation and evaluating its performance in grinding soft and brittle materials

Meina Qu, Tan Jin, Guizhi Xie, Rui Cai

    Research output: Contribution to journalArticlepeer-review

    12 Citations (Scopus)
    103 Downloads (Pure)


    In this study, a binderless diamond grinding wheel (BDGW) is fabricated to prevent impurities embedding during the machining of soft and brittle materials by conventional grinding wheels. The ‘binder’ features, as well as the ‘grains’, are produced on a single piece of chemical vapor deposition diamond, whilst the ‘grains’ are ablated with a femtosecond laser. The performance of the novel grinding tool in terms of grinding radio, wear types, grinding forces and specific grinding energy, ground surface roughness, surface morphology, and subsurface damage is evaluated by comparing it with a resin-bonded diamond grinding wheel (RDGW). Experimental results show that the BDGW has excellent redress life with simple form of wear-abrasion wear on the top of the cutting edges and extremely high grinding radio of 103, which is nearly eight times of that of the RDGW. The benefit of the simple form of BDGW wear is that no embedded bond debris and fall-off grains appear. These conditions are essential to ensuring high ground surface quality for grinding soft and brittle materials.
    Original languageEnglish
    Article number116359
    Number of pages9
    JournalJournal of Materials Processing Technology
    Early online date9 Aug 2019
    Publication statusPublished - Jan 2020

    Bibliographical note

    NOTICE: this is the author’s version of a work that was accepted for publication in Journal of Materials Processing Technology. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Journal of Materials Processing Technology, 275, (2020) DOI: 10.1016/j.jmatprotec.2019.116359

    © 2019, Elsevier. Licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International


    • Binderless diamond grinding wheel
    • Chemical vapor deposition diamond
    • Femtosecond laser ablation
    • Grinding performance

    ASJC Scopus subject areas

    • Ceramics and Composites
    • Computer Science Applications
    • Metals and Alloys
    • Industrial and Manufacturing Engineering


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