Atomic Layer Deposition (ALD) to Mitigate Tin Whisker Growth and Corrosion Issues on Printed Circuit Board Assemblies

Terho Terho Kutilainen, Marko Pudas, Mark Ashworth, Tero Lehto, Liang Wu, Geoffrey Wilcox, Jing Wang, Paul Collander, Jussi Hokka

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Physics & Astronomy

Chemical Compounds

Engineering & Materials Science