Atomic Layer Deposition (ALD) to Mitigate Tin Whisker Growth and Corrosion Issues on Printed Circuit Board Assemblies

Terho Terho Kutilainen, Marko Pudas, Mark Ashworth, Tero Lehto, Liang Wu, Geoffrey Wilcox, Jing Wang, Paul Collander, Jussi Hokka

Research output: Contribution to journalArticle

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Abstract

This paper presents the results of a research program set up to evaluate atomic layer deposition (ALD) conformal coatings as a method of mitigating the growth of tin whiskers from printed circuit board assemblies. The effect of ALD coating process variables on the ability of the coating to mitigate whisker growth were evaluated. Scanning electron microscopy and optical microscopy were used to evaluate both the size and distribution of tin whiskers and the coating/whisker interactions. Results show that the ALD process can achieve significant reductions in whisker growth and thus offers considerable potential as a reworkable whisker mitigation strategy. The effect of ALD layer thickness on whisker formation was also investigated. Studies indicate that thermal exposure during ALD processing may contribute significantly to the observed whisker mitigation.

Original languageEnglish
Pages (from-to)7573-7584
Number of pages12
JournalJournal of Electronic Materials
Volume48
Issue number11
Early online date23 Aug 2019
DOIs
Publication statusPublished - Nov 2019

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Tin
Atomic layer deposition
printed circuits
circuit boards
atomic layer epitaxy
Printed circuit boards
assemblies
tin
corrosion
Corrosion
Coatings
coatings
Optical microscopy
coating
microscopy
Scanning electron microscopy
scanning electron microscopy
Processing
interactions

Bibliographical note

This article is distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.

Keywords

  • ALD
  • Tin whiskers
  • atomic layer deposition
  • corrosion

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

Atomic Layer Deposition (ALD) to Mitigate Tin Whisker Growth and Corrosion Issues on Printed Circuit Board Assemblies. / Terho Kutilainen, Terho; Pudas, Marko; Ashworth, Mark ; Lehto, Tero; Wu, Liang; Wilcox, Geoffrey; Wang, Jing; Collander, Paul; Hokka, Jussi.

In: Journal of Electronic Materials, Vol. 48, No. 11, 11.2019, p. 7573-7584.

Research output: Contribution to journalArticle

Terho Kutilainen, T, Pudas, M, Ashworth, M, Lehto, T, Wu, L, Wilcox, G, Wang, J, Collander, P & Hokka, J 2019, 'Atomic Layer Deposition (ALD) to Mitigate Tin Whisker Growth and Corrosion Issues on Printed Circuit Board Assemblies' Journal of Electronic Materials, vol. 48, no. 11, pp. 7573-7584. https://doi.org/10.1007/s11664-019-07534-7
Terho Kutilainen, Terho ; Pudas, Marko ; Ashworth, Mark ; Lehto, Tero ; Wu, Liang ; Wilcox, Geoffrey ; Wang, Jing ; Collander, Paul ; Hokka, Jussi. / Atomic Layer Deposition (ALD) to Mitigate Tin Whisker Growth and Corrosion Issues on Printed Circuit Board Assemblies. In: Journal of Electronic Materials. 2019 ; Vol. 48, No. 11. pp. 7573-7584.
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