Application of synchrotron X-ray diffraction and nanoindentation for the determination of residual stress fields around scratches

Kashif Khan, Michael Fitzpatrick, Sarah Hainsworth, A. D. Evans, L. Edwards

Research output: Contribution to journalArticle

25 Citations (Scopus)

Abstract

Residual stresses and plastic deformation around scratches or scribe marks in ductile materials can affect fatigue life. Scratches of the order of tens of microns may convert into propagating cracks driven by tensile residual stresses at the scratch root. Probing such stresses on a small scale is experimentally challenging in engineering materials. Here we present results of a combined study using synchrotron X-ray diffraction and nanoindentation to determine the residual stresses around scratches in aluminium alloys. The extraction of residual stresses in metallic materials where there is work hardening is challenging using indentation methods, but a method is presented by which this has been achieved, and a good correlation is obtained between the results obtained using diffraction and nanoindentation. The advantage of synchrotron X-ray measurement is that it allows validation of the stresses at the same
Original languageEnglish
Pages (from-to)7508-7520
Number of pages13
JournalActa Materialia
Volume59
Issue number20
DOIs
Publication statusPublished - 2011

Keywords

  • Nanoindentation
  • Synchrotron radiation
  • X-ray diffraction
  • Aluminium alloys
  • Residual stresses

Fingerprint Dive into the research topics of 'Application of synchrotron X-ray diffraction and nanoindentation for the determination of residual stress fields around scratches'. Together they form a unique fingerprint.

  • Cite this