Analysis on Lapping and Polishing Pressure Distribution

Guangqi Cai, Y. S. Lu, Rui Cai, H.W. Zheng

Research output: Contribution to journalArticlepeer-review

34 Citations (Scopus)


In the processes of plane lapping and polishing, the pressure distribution between the workpiece and the lapping plate or the polishing pad is very important to flatness generation. This paper presents elastic contact models for plane lapping and polishing with or without guard ring. Based on these models, the pressure distribution has been obtained. Furthermore, the effects of various parameters on the pressure distribution, such as the material properties of the workpiece, the plate and the pad, the ratio of load bearing on the guard ring to the total load, the width of the guard ring, the gap between the workpiece and the guard ring, and the thickness of the polishing pad, have been discussed
Original languageEnglish
Pages (from-to)235-238
Number of pages4
JournalCIRP Annals - Manufacturing Technology
Issue number1
Publication statusPublished - 1998
Externally publishedYes


  • Lapping
  • Polishing
  • Pressure


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