An IEC 61499 based run-to-run controller for chemical mechanical planarization process

K. M. Goh, B. Tjahjono, A. Manaf, A. J.R. Aendenroomer

Research output: Chapter in Book/Report/Conference proceedingConference proceeding

Abstract

The paper presented the IEC 61499 based Run-To-Run Controller for Chemical Mechanical Planarization process. Experiments show the needs of adjust the removal rate based on the actual data captured from manufacturing line rather than default values to calculate removal rate for every lot and use removal rate to calculate polish time for the next lot which would be polished next in the polish tool. Two key components of the controller namely removal rate calculation and polish time calculation was developed and the result from both components was captured and analyzed.

Original languageEnglish
Title of host publicationProceedings of the 13th IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2008
Pages25-28
Number of pages4
DOIs
Publication statusPublished - 24 Nov 2008
Externally publishedYes
Event13th IEEE International Conference on Emerging Technologies and Factory Automation, - Hamburg, Germany
Duration: 15 Sep 200818 Sep 2008
Conference number: 13
https://publik.tuwien.ac.at/files/PubDat_167557.pdf

Conference

Conference13th IEEE International Conference on Emerging Technologies and Factory Automation,
Abbreviated titleETFA 2008
CountryGermany
CityHamburg
Period15/09/0818/09/08
Internet address

Keywords

  • Films
  • Manufacturing
  • Planarization
  • IEC
  • Time measurement
  • Materials
  • Process control

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Control and Systems Engineering
  • Industrial and Manufacturing Engineering
  • Computer Science Applications

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