Abstract
The paper presented the IEC 61499 based Run-To-Run Controller for Chemical Mechanical Planarization process. Experiments show the needs of adjust the removal rate based on the actual data captured from manufacturing line rather than default values to calculate removal rate for every lot and use removal rate to calculate polish time for the next lot which would be polished next in the polish tool. Two key components of the controller namely removal rate calculation and polish time calculation was developed and the result from both components was captured and analyzed.
Original language | English |
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Title of host publication | Proceedings of the 13th IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2008 |
Pages | 25-28 |
Number of pages | 4 |
DOIs | |
Publication status | Published - 24 Nov 2008 |
Externally published | Yes |
Event | 13th IEEE International Conference on Emerging Technologies and Factory Automation, - Hamburg, Germany Duration: 15 Sept 2008 → 18 Sept 2008 Conference number: 13 https://publik.tuwien.ac.at/files/PubDat_167557.pdf |
Conference
Conference | 13th IEEE International Conference on Emerging Technologies and Factory Automation, |
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Abbreviated title | ETFA 2008 |
Country/Territory | Germany |
City | Hamburg |
Period | 15/09/08 → 18/09/08 |
Internet address |
Keywords
- Films
- Manufacturing
- Planarization
- IEC
- Time measurement
- Materials
- Process control
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Control and Systems Engineering
- Industrial and Manufacturing Engineering
- Computer Science Applications