An IEC 61499 based run-to-run controller for chemical mechanical planarization process

K. M. Goh; B. Tjahjono; A. Manaf; A. J.R. Aendenroomer

doi:10.1109/ETFA.2008.4638364

An IEC 61499 based run-to-run controller for chemical mechanical planarization process

K. M. Goh, B. Tjahjono, A. Manaf, A. J.R. Aendenroomer

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding › peer-review

Abstract

The paper presented the IEC 61499 based Run-To-Run Controller for Chemical Mechanical Planarization process. Experiments show the needs of adjust the removal rate based on the actual data captured from manufacturing line rather than default values to calculate removal rate for every lot and use removal rate to calculate polish time for the next lot which would be polished next in the polish tool. Two key components of the controller namely removal rate calculation and polish time calculation was developed and the result from both components was captured and analyzed.

Original language	English
Title of host publication	Proceedings of the 13th IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2008
Pages	25-28
Number of pages	4
DOIs	https://doi.org/10.1109/ETFA.2008.4638364
Publication status	Published - 24 Nov 2008
Externally published	Yes
Event	13th IEEE International Conference on Emerging Technologies and Factory Automation, - Hamburg, Germany Duration: 15 Sept 2008 → 18 Sept 2008 Conference number: 13 https://publik.tuwien.ac.at/files/PubDat_167557.pdf

Conference

Conference	13th IEEE International Conference on Emerging Technologies and Factory Automation,
Abbreviated title	ETFA 2008
Country/Territory	Germany
City	Hamburg
Period	15/09/08 → 18/09/08
Internet address	https://publik.tuwien.ac.at/files/PubDat_167557.pdf

Keywords

Films
Manufacturing
Planarization
IEC
Time measurement
Materials
Process control

ASJC Scopus subject areas

Electrical and Electronic Engineering
Control and Systems Engineering
Industrial and Manufacturing Engineering
Computer Science Applications

Access to Document

10.1109/ETFA.2008.4638364

Cite this

An IEC 61499 based run-to-run controller for chemical mechanical planarization process. / Goh, K. M.; Tjahjono, B.; Manaf, A. et al.

Proceedings of the 13th IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2008. 2008. p. 25-28 4638364.

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding › peer-review

Goh, KM, Tjahjono, B, Manaf, A & Aendenroomer, AJR 2008, An IEC 61499 based run-to-run controller for chemical mechanical planarization process. in Proceedings of the 13th IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2008., 4638364, pp. 25-28, 13th IEEE International Conference on Emerging Technologies and Factory Automation, Hamburg, Germany, 15/09/08. https://doi.org/10.1109/ETFA.2008.4638364

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title = "An IEC 61499 based run-to-run controller for chemical mechanical planarization process",

abstract = "The paper presented the IEC 61499 based Run-To-Run Controller for Chemical Mechanical Planarization process. Experiments show the needs of adjust the removal rate based on the actual data captured from manufacturing line rather than default values to calculate removal rate for every lot and use removal rate to calculate polish time for the next lot which would be polished next in the polish tool. Two key components of the controller namely removal rate calculation and polish time calculation was developed and the result from both components was captured and analyzed.",

keywords = "Films, Manufacturing, Planarization, IEC, Time measurement, Materials, Process control",

author = "Goh, {K. M.} and B. Tjahjono and A. Manaf and Aendenroomer, {A. J.R.}",

year = "2008",

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doi = "10.1109/ETFA.2008.4638364",

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AB - The paper presented the IEC 61499 based Run-To-Run Controller for Chemical Mechanical Planarization process. Experiments show the needs of adjust the removal rate based on the actual data captured from manufacturing line rather than default values to calculate removal rate for every lot and use removal rate to calculate polish time for the next lot which would be polished next in the polish tool. Two key components of the controller namely removal rate calculation and polish time calculation was developed and the result from both components was captured and analyzed.

KW - Films

KW - Manufacturing

KW - Planarization

KW - IEC

KW - Time measurement

KW - Materials

KW - Process control

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An IEC 61499 based run-to-run controller for chemical mechanical planarization process

Abstract

Conference

Keywords

ASJC Scopus subject areas

Access to Document

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