An advanced finite element strategy for thermal stress field investigation in aluminum interconnections during processing of very large scale integration multilevel structures

P. M. Igic, P. A. Mawby

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

An advanced strategy for modelling the thermal stress induced in aluminum interconnections during processing of multilevel structures is presented. The advantage of the approach described is that it allows the residual stresses from one processing step to be used as the initial conditions for a subsequent step. 2D elasto-plastic model (von Mises plastic criterion) is implemented in Finite Element Code and it is shown that even after significant relaxation by plastic deformation, high thermal stress resides in the aluminum line in both width and thickness directions. The technique demonstrated here is for a silicon-glass-aluminum-glass structure. However, it is readily extended to more complex situations and material combinations.

Original languageEnglish
Pages (from-to)1207-1212
Number of pages6
JournalMicroelectronics Journal
Volume30
Issue number12
Early online date27 Sep 1999
DOIs
Publication statusPublished - 1 Dec 1999
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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