Abstract
The metallisation of non-conductive materials is an important manufacturing process which is utilised throughout the metal finishing and electronics industry. One of the most critical stages in the metallisation process is the surface modification of the non-conductive substrate as this will often determine the subsequent adhesion. The present paper reviews the traditional wet chemical surface modification processes employed in metal finishing and electronic manufacturing and reveals that many of these are characterised by the use of hazardous chemistry. With environmental and health and safety legislation becoming stricter 'greener and cleaner' processes are becoming more desirable and this review will show that over the past 30-40 years several alternative approaches to surface modification have been investigated. Few of these processes have been commercialised but, with legislative pressures building, it is now perhaps time to revisit some of these less conventional techniques.
Original language | English |
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Pages (from-to) | 293-297 |
Number of pages | 5 |
Journal | Transactions of the Institute of Metal Finishing |
Volume | 85 |
Issue number | 6 |
DOIs | |
Publication status | Published - Nov 2007 |
Bibliographical note
Publisher Statement: This is an Accepted Manuscript of an article published by Taylor & Francis in Transactions of the Institute of Metal Finishing in 2007, available online: http://www.tandfonline.com/10.1179/174591907X246528Keywords
- Electroless deposition
- Electroplating
- Modification
- PCB
- Surface
- Ultrasound
ASJC Scopus subject areas
- Surfaces, Coatings and Films
- Surfaces and Interfaces
- Metals and Alloys