Additional grain boundary strengthening in length-scale architectured copper with ultrafine and coarse domains

Xiaodong Hou, Sebastian Krauß, Benoit Merle

Research output: Contribution to journalArticle

Abstract

The strength of polycrystals is known to increase with decreasing grain size, known as Hall-Petch effect. However, this relationship fails to predict the strength of samples with a non-uniform distribution of grain sizes. In this study, we purposely designed and fabricated copper micropillars with a strongly bimodal microstructure: half volume consisted of a large number of ultrafine grains, while the other half was predominantly single-crystalline. Micropillar compression evidenced that bimodal samples are 35% stronger than their counterparts containing only ultrafine grains. This paradoxical finding highlights the greater strengthening potential of microstructure distribution engineering, compared to the traditional grain refinement strategy.
LanguageEnglish
Pages55-59
Number of pages5
JournalScripta Materialia
Volume165
Early online date19 Feb 2019
DOIs
Publication statusPublished - May 2019

Fingerprint

Strengthening (metal)
Copper
Grain boundaries
grain boundaries
copper
Microstructure
Grain refinement
Polycrystals
Hall effect
grain size
microstructure
Compaction
polycrystals
Crystalline materials
engineering
Ultrafine

Keywords

  • Bimodal grained microstructure
  • Crystal structure
  • Grain boundary strengthening
  • Hall-Petch effect
  • Mechanical property testing

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

Cite this

Additional grain boundary strengthening in length-scale architectured copper with ultrafine and coarse domains. / Hou, Xiaodong; Krauß, Sebastian; Merle, Benoit .

In: Scripta Materialia, Vol. 165, 05.2019, p. 55-59.

Research output: Contribution to journalArticle

Hou, Xiaodong ; Krauß, Sebastian ; Merle, Benoit . / Additional grain boundary strengthening in length-scale architectured copper with ultrafine and coarse domains. In: Scripta Materialia. 2019 ; Vol. 165. pp. 55-59.
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