A wire-bond-less 10 kv sic mosfet power module with reduced common-mode noise and electric field

Christina Dimarino; Bassem Mouawad; Ke Li; Yue Xu; Mark Johnson; Dushan Boroyevich; Rolando Burgos

A wire-bond-less 10 kv sic mosfet power module with reduced common-mode noise and electric field

Christina Dimarino, Bassem Mouawad, Ke Li, Yue Xu, Mark Johnson, Dushan Boroyevich, Rolando Burgos

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding › peer-review

Abstract

Wide-bandgap devices offer many benefits. In particular, the new 10 kV silicon carbide (SiC) MOSFETs can switch higher voltages faster and with lower losses than silicon devices while also being smaller in size. However, these features can result in premature dielectric breakdown, higher voltage overshoots, high-frequency current and voltage oscillations, and greater electromagnetic interference. In order to mitigate these side effects and thus fully utilize the benefits of these unique devices, advanced module packaging is needed. This work proposes a power module package with a small footprint (68 mm × 83 mm), low gate-and power-loop inductances (4 nH), increased partial discharge inception voltage (53 %), and reduced common-mode current (90 %).

Original language	English
Title of host publication	PCIM Europe 2018; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
Editors	Achim Scharf
Publisher	Vde Verlag GmbH
Pages	74-80
Number of pages	7
Edition	225809
ISBN (Print)	9783800746460
Publication status	Published - 1 Jan 2018
Externally published	Yes
Event	International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018 - Nuremberg, Germany Duration: 5 Jun 2018 → 7 Jun 2018

Publication series

Name	PCIM Europe Conference Proceedings
Number	225809
ISSN (Electronic)	2191-3358

Conference

Conference	International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018
Abbreviated title	PCIM Europe 2018
Country/Territory	Germany
City	Nuremberg
Period	5/06/18 → 7/06/18

Funding

The authors acknowledge experimental assistance from Dr. Jianfeng Li and Dr. Robert Skuriat. The authors also acknowledge the assistance of Dr. Xiangyong Feng and the Center for Electromechanics at the University of Texas at Austin in conducting the partial discharge tests. The donation of substrates from DOWA and 10 kV SiC MOSFET die from Wolfspeed, a Cree Company, are greatly appreciated. This work was funded in part by the UK Engineering and Physical Sciences Research Council (EPSRC) through research grant [EP/K035304/1] and the CPES High Density Integration Consortium.

ASJC Scopus subject areas

Electrical and Electronic Engineering

Cite this

Dimarino, C., Mouawad, B., Li, K., Xu, Y., Johnson, M., Boroyevich, D., & Burgos, R. (2018). A wire-bond-less 10 kv sic mosfet power module with reduced common-mode noise and electric field. In A. Scharf (Ed.), PCIM Europe 2018; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (225809 ed., pp. 74-80). (PCIM Europe Conference Proceedings; No. 225809). Vde Verlag GmbH.

A wire-bond-less 10 kv sic mosfet power module with reduced common-mode noise and electric field. / Dimarino, Christina; Mouawad, Bassem; Li, Ke et al.
PCIM Europe 2018; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. ed. / Achim Scharf. 225809. ed. Vde Verlag GmbH, 2018. p. 74-80 (PCIM Europe Conference Proceedings; No. 225809).

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding › peer-review

Dimarino, C, Mouawad, B, Li, K, Xu, Y, Johnson, M, Boroyevich, D & Burgos, R 2018, A wire-bond-less 10 kv sic mosfet power module with reduced common-mode noise and electric field. in A Scharf (ed.), PCIM Europe 2018; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. 225809 edn, PCIM Europe Conference Proceedings, no. 225809, Vde Verlag GmbH, pp. 74-80, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018, Nuremberg, Germany, 5/06/18.

Dimarino C, Mouawad B, Li K, Xu Y, Johnson M, Boroyevich D et al. A wire-bond-less 10 kv sic mosfet power module with reduced common-mode noise and electric field. In Scharf A, editor, PCIM Europe 2018; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. 225809 ed. Vde Verlag GmbH. 2018. p. 74-80. (PCIM Europe Conference Proceedings; 225809).

Dimarino, Christina ; Mouawad, Bassem ; Li, Ke et al. / A wire-bond-less 10 kv sic mosfet power module with reduced common-mode noise and electric field. PCIM Europe 2018; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. editor / Achim Scharf. 225809. ed. Vde Verlag GmbH, 2018. pp. 74-80 (PCIM Europe Conference Proceedings; 225809).

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A wire-bond-less 10 kv sic mosfet power module with reduced common-mode noise and electric field

Abstract

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ASJC Scopus subject areas

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