TY - GEN
T1 - A wire-bond-less 10 kv sic mosfet power module with reduced common-mode noise and electric field
AU - Dimarino, Christina
AU - Mouawad, Bassem
AU - Li, Ke
AU - Xu, Yue
AU - Johnson, Mark
AU - Boroyevich, Dushan
AU - Burgos, Rolando
PY - 2018/1/1
Y1 - 2018/1/1
N2 - Wide-bandgap devices offer many benefits. In particular, the new 10 kV silicon carbide (SiC) MOSFETs can switch higher voltages faster and with lower losses than silicon devices while also being smaller in size. However, these features can result in premature dielectric breakdown, higher voltage overshoots, high-frequency current and voltage oscillations, and greater electromagnetic interference. In order to mitigate these side effects and thus fully utilize the benefits of these unique devices, advanced module packaging is needed. This work proposes a power module package with a small footprint (68 mm × 83 mm), low gate-and power-loop inductances (4 nH), increased partial discharge inception voltage (53 %), and reduced common-mode current (90 %).
AB - Wide-bandgap devices offer many benefits. In particular, the new 10 kV silicon carbide (SiC) MOSFETs can switch higher voltages faster and with lower losses than silicon devices while also being smaller in size. However, these features can result in premature dielectric breakdown, higher voltage overshoots, high-frequency current and voltage oscillations, and greater electromagnetic interference. In order to mitigate these side effects and thus fully utilize the benefits of these unique devices, advanced module packaging is needed. This work proposes a power module package with a small footprint (68 mm × 83 mm), low gate-and power-loop inductances (4 nH), increased partial discharge inception voltage (53 %), and reduced common-mode current (90 %).
UR - http://www.scopus.com/inward/record.url?scp=85060033946&partnerID=8YFLogxK
M3 - Conference proceeding
AN - SCOPUS:85060033946
SN - 9783800746460
T3 - PCIM Europe Conference Proceedings
SP - 74
EP - 80
BT - PCIM Europe 2018; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
A2 - Scharf, Achim
PB - Vde Verlag GmbH
T2 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018
Y2 - 5 June 2018 through 7 June 2018
ER -