A Strategy to Reduce the Peak Temperature of the Chip Working under Dynamic Power Using the Transient Cooling Effect of the Thin-Film Thermoelectric Cooler

Yongjia Wu; Sen Chen; Tingrui Gong; Tianhao Shi; Lei Zuo; Yonggao Yan; Yueping Fang; Tingzhen Ming

doi:10.1007/s11630-022-1637-2

A Strategy to Reduce the Peak Temperature of the Chip Working under Dynamic Power Using the Transient Cooling Effect of the Thin-Film Thermoelectric Cooler

Yongjia Wu
, Sen Chen
, Tingrui Gong
, Tianhao Shi
, Lei Zuo
, Yonggao Yan
, Yueping Fang
, Tingzhen Ming

Centre for Manufacturing and Materials

Research output: Contribution to journal › Article › peer-review

8 Citations (Scopus)

130 Downloads (Pure)

Abstract

The thin-film thermoelectric cooler (TEC) is a promising solid-state heat pump that can remove the high local heat flux of chips utilizing the Peltier effect. When an electric current pulse is applied to the thin-film TEC, the TEC can achieve an instantaneous lower temperature compared to that created by a steady current. In this paper, we developed a novel strategy to reduce the peak temperature of the chip working under dynamic power, thus making the semiconductor chip operate reliably and efficiently. A three-dimensional numerical model was built to study the transient cooling performance of the thin-film TEC on chips. The effects of parameters, such as the current pulse, the heat flux, the thermoelement length, the number of thermoelements, and the contact resistance on the performance of the thin-film TEC, were investigated. The results showed that when a current pulse of 0.6 A was applied to the thin-film TEC before the peak power of the chip, the peak temperature of the chip was reduced by more than 10°C, making the thin-film thermoelectric cooler a promising technology for the temperature control of modern chips with high peak powers.

Original language	English
Pages (from-to)	1094-1105
Number of pages	12
Journal	Journal of Thermal Science
Volume	31
Issue number	4
DOIs	https://doi.org/10.1007/s11630-022-1637-2
Publication status	Published - 20 Jul 2022

Bibliographical note

Copyright © and Moral Rights are retained by the author(s) and/ or other copyright owners. A copy can be downloaded for personal non-commercial research or study, without prior permission or charge. This item cannot be reproduced or quoted extensively from without first obtaining permission in writing from the copyright holder(s). The content must not be changed in any way or sold commercially in any format or medium without the formal permission of the copyright holders.

This document is the author’s post-print version, incorporating any revisions agreed during the peer-review process. Some differences between the published version and this version may remain and you are advised to consult the published version if you wish to cite from it.

Funder

This research was supported by the National Natural Science Foundation of China (Grant No. 51778511), Natural Science Foundation of Hubei Province (Grant No. 2018CFA029), Key Research and Design Projects of Hubei Province (Grant No. 2020BAB129), Key Project of ESI Discipline Development of Wuhan University of Technology (Grant No. 2017001), and Scientific Research Foundation of Wuhan University of Technology (Nos. 40120237 and 40120551), and the Fundamental Research Funds for the Central Universities (WUT: 2021IVA037). The support to Dr. FANG Yueping from EU Horizon 2020 Marie Curie Global Fellowship (Grant No. 841183) was appreciated.

Funding

This research was supported by the National Natural Science Foundation of China (Grant No. 51778511), Natural Science Foundation of Hubei Province (Grant No. 2018CFA029), Key Research and Design Projects of Hubei Province (Grant No. 2020BAB129), Key Project of ESI Discipline Development of Wuhan University of Technology (Grant No. 2017001), and Scientific Research Foundation of Wuhan University of Technology (Nos. 40120237 and 40120551), and the Fundamental Research Funds for the Central Universities (WUT: 2021IVA037). The support to Dr. FANG Yueping from EU Horizon 2020 Marie Curie Global Fellowship (Grant No. 841183) was appreciated.

Funders	Funder number
Wuhan University of Technology	2017001
Horizon Europe	841183
Fundamental Research Funds for the Central Universities	2021IVA037
National Natural Science Foundation of China	51778511
Natural Science Foundation of Hubei Province	2018CFA029
Wuhan University of Technology	40120551, 40120237
Key Research and Design Projects of Hubei Province	2020BAB129

Keywords

heat transfer
temperature control
thermoelectric cooler
transient cooling

ASJC Scopus subject areas

Condensed Matter Physics

Access to Document

10.1007/s11630-022-1637-2

Post-PrintAccepted author manuscript, 2.37 MBLicence: Unspecified

Cite this

@article{bd9a6726a7294602b42a9d33c0890e8c,

title = "A Strategy to Reduce the Peak Temperature of the Chip Working under Dynamic Power Using the Transient Cooling Effect of the Thin-Film Thermoelectric Cooler",

abstract = "The thin-film thermoelectric cooler (TEC) is a promising solid-state heat pump that can remove the high local heat flux of chips utilizing the Peltier effect. When an electric current pulse is applied to the thin-film TEC, the TEC can achieve an instantaneous lower temperature compared to that created by a steady current. In this paper, we developed a novel strategy to reduce the peak temperature of the chip working under dynamic power, thus making the semiconductor chip operate reliably and efficiently. A three-dimensional numerical model was built to study the transient cooling performance of the thin-film TEC on chips. The effects of parameters, such as the current pulse, the heat flux, the thermoelement length, the number of thermoelements, and the contact resistance on the performance of the thin-film TEC, were investigated. The results showed that when a current pulse of 0.6 A was applied to the thin-film TEC before the peak power of the chip, the peak temperature of the chip was reduced by more than 10°C, making the thin-film thermoelectric cooler a promising technology for the temperature control of modern chips with high peak powers.",

keywords = "heat transfer, temperature control, thermoelectric cooler, transient cooling",

author = "Yongjia Wu and Sen Chen and Tingrui Gong and Tianhao Shi and Lei Zuo and Yonggao Yan and Yueping Fang and Tingzhen Ming",

note = "Copyright {\textcopyright} and Moral Rights are retained by the author(s) and/ or other copyright owners. A copy can be downloaded for personal non-commercial research or study, without prior permission or charge. This item cannot be reproduced or quoted extensively from without first obtaining permission in writing from the copyright holder(s). The content must not be changed in any way or sold commercially in any format or medium without the formal permission of the copyright holders. This document is the author{\textquoteright}s post-print version, incorporating any revisions agreed during the peer-review process. Some differences between the published version and this version may remain and you are advised to consult the published version if you wish to cite from it. ",

year = "2022",

month = jul,

day = "20",

doi = "10.1007/s11630-022-1637-2",

language = "English",

volume = "31",

pages = "1094--1105",

journal = "Journal of Thermal Science",

issn = "1003-2169",

publisher = "Science Press",

number = "4",

}

TY - JOUR

T1 - A Strategy to Reduce the Peak Temperature of the Chip Working under Dynamic Power Using the Transient Cooling Effect of the Thin-Film Thermoelectric Cooler

AU - Wu, Yongjia

AU - Chen, Sen

AU - Gong, Tingrui

AU - Shi, Tianhao

AU - Zuo, Lei

AU - Yan, Yonggao

AU - Fang, Yueping

AU - Ming, Tingzhen

N1 - Copyright © and Moral Rights are retained by the author(s) and/ or other copyright owners. A copy can be downloaded for personal non-commercial research or study, without prior permission or charge. This item cannot be reproduced or quoted extensively from without first obtaining permission in writing from the copyright holder(s). The content must not be changed in any way or sold commercially in any format or medium without the formal permission of the copyright holders. This document is the author’s post-print version, incorporating any revisions agreed during the peer-review process. Some differences between the published version and this version may remain and you are advised to consult the published version if you wish to cite from it.

PY - 2022/7/20

Y1 - 2022/7/20

N2 - The thin-film thermoelectric cooler (TEC) is a promising solid-state heat pump that can remove the high local heat flux of chips utilizing the Peltier effect. When an electric current pulse is applied to the thin-film TEC, the TEC can achieve an instantaneous lower temperature compared to that created by a steady current. In this paper, we developed a novel strategy to reduce the peak temperature of the chip working under dynamic power, thus making the semiconductor chip operate reliably and efficiently. A three-dimensional numerical model was built to study the transient cooling performance of the thin-film TEC on chips. The effects of parameters, such as the current pulse, the heat flux, the thermoelement length, the number of thermoelements, and the contact resistance on the performance of the thin-film TEC, were investigated. The results showed that when a current pulse of 0.6 A was applied to the thin-film TEC before the peak power of the chip, the peak temperature of the chip was reduced by more than 10°C, making the thin-film thermoelectric cooler a promising technology for the temperature control of modern chips with high peak powers.

AB - The thin-film thermoelectric cooler (TEC) is a promising solid-state heat pump that can remove the high local heat flux of chips utilizing the Peltier effect. When an electric current pulse is applied to the thin-film TEC, the TEC can achieve an instantaneous lower temperature compared to that created by a steady current. In this paper, we developed a novel strategy to reduce the peak temperature of the chip working under dynamic power, thus making the semiconductor chip operate reliably and efficiently. A three-dimensional numerical model was built to study the transient cooling performance of the thin-film TEC on chips. The effects of parameters, such as the current pulse, the heat flux, the thermoelement length, the number of thermoelements, and the contact resistance on the performance of the thin-film TEC, were investigated. The results showed that when a current pulse of 0.6 A was applied to the thin-film TEC before the peak power of the chip, the peak temperature of the chip was reduced by more than 10°C, making the thin-film thermoelectric cooler a promising technology for the temperature control of modern chips with high peak powers.

KW - heat transfer

KW - temperature control

KW - thermoelectric cooler

KW - transient cooling

UR - https://www.scopus.com/pages/publications/85134399038

U2 - 10.1007/s11630-022-1637-2

DO - 10.1007/s11630-022-1637-2

M3 - Article

AN - SCOPUS:85134399038

SN - 1003-2169

VL - 31

SP - 1094

EP - 1105

JO - Journal of Thermal Science

JF - Journal of Thermal Science

IS - 4

ER -

A Strategy to Reduce the Peak Temperature of the Chip Working under Dynamic Power Using the Transient Cooling Effect of the Thin-Film Thermoelectric Cooler

Abstract

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Keywords

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