TY - GEN
T1 - A High Power Diode Laser (HPDL)-based technique for the bonding of composite patches to aluminium alloys on various military aircraft
AU - Lawrence, Jonathan
PY - 2004
Y1 - 2004
N2 - A rapid, effective and repeatable technique for repairing the damaged skins of various military aircraft, both fixed and rotary winged, using a high power diode laser (HPDL) is described herein. The HPDL was traversed across the surface of an APC-2 repair patch, thereby melting a thermoplastic adhesive placed in between the repair patch and an Alclad substrate, consequently bonding the repair patch to the Alclad substrate. When subjected to single lap shear tests, the shear strength of the HPDL bond was 47.8 ± 4.7 MPa, compared to 32.4 ± 3.7 MPa for the induction welded samples. When subjected to the Boeing wedge test, the HPDL samples had a 1 h crack growth rate that was rated as very good (1.9 ± 0.5 mm/h); for the induction welded samples the 1 h crack growth rate that was rated as good (2.7 ± 1.2 mm/h). Of great significance was processing time achieved with the HPDL, which was reduced from 11.75 mins when employing induction welding to 2.75 mins with the HPDL. Moreover, the HPDL has been shown in this work to be a tool for bonding that is superior to its contemporary counterparts. It is, therefore, distinctly possible that even stronger bonds could be achieved with the HPDL if different adhesives were used.
AB - A rapid, effective and repeatable technique for repairing the damaged skins of various military aircraft, both fixed and rotary winged, using a high power diode laser (HPDL) is described herein. The HPDL was traversed across the surface of an APC-2 repair patch, thereby melting a thermoplastic adhesive placed in between the repair patch and an Alclad substrate, consequently bonding the repair patch to the Alclad substrate. When subjected to single lap shear tests, the shear strength of the HPDL bond was 47.8 ± 4.7 MPa, compared to 32.4 ± 3.7 MPa for the induction welded samples. When subjected to the Boeing wedge test, the HPDL samples had a 1 h crack growth rate that was rated as very good (1.9 ± 0.5 mm/h); for the induction welded samples the 1 h crack growth rate that was rated as good (2.7 ± 1.2 mm/h). Of great significance was processing time achieved with the HPDL, which was reduced from 11.75 mins when employing induction welding to 2.75 mins with the HPDL. Moreover, the HPDL has been shown in this work to be a tool for bonding that is superior to its contemporary counterparts. It is, therefore, distinctly possible that even stronger bonds could be achieved with the HPDL if different adhesives were used.
UR - http://www.scopus.com/inward/record.url?scp=85086423122&partnerID=8YFLogxK
U2 - 10.2351/1.5060205
DO - 10.2351/1.5060205
M3 - Conference proceeding
AN - SCOPUS:85086423122
SN - 0912035773
SN - 9780912035772
T3 - ICALEO 2004 - 23rd International Congress on Applications of Laser and Electro-Optics, Congress Proceedings
BT - ICALEO 2004 - 23rd International Congress on Applications of Laser and Electro-Optics, Congress Proceedings
PB - Laser Institute of America
T2 - 23rd International Congress on Applications of Laser and Electro-Optics
Y2 - 4 October 2004 through 7 October 2004
ER -