• 28 Citations
  • 3 h-Index
20152020

Research output per year

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Research Output

  • 28 Citations
  • 3 h-Index
  • 8 Article
  • 2 Conference proceeding
  • 1 Review article
2020
Open Access
File
3 Downloads (Pure)
2019

A route to a more sustainable nickel composite electrodeposit, using turmeric and a new low nickel ion concentration electrolyte

Merrill, R. J., Wu, L., Graves, J., Beddow, J., Fuentes, E. & Cobley, A., 25 Dec 2019, In : Surface and Coatings Technology. 380, 125024.

Research output: Contribution to journalArticle

Atomic Layer Deposition (ALD) to Mitigate Tin Whisker Growth and Corrosion Issues on Printed Circuit Board Assemblies

Terho Kutilainen, T., Pudas, M., Ashworth, M., Lehto, T., Wu, L., Wilcox, G., Wang, J., Collander, P. & Hokka, J., Nov 2019, In : Journal of Electronic Materials. 48, 11, p. 7573-7584 12 p.

Research output: Contribution to journalArticle

Open Access
File
12 Downloads (Pure)
Open Access
File
1 Downloads (Pure)
2018

Mechanism for the development of Sn-Cu alloy coatings produced by pulsed current electrodeposition

Wu, L., Graves, J. & Cobley, A., 15 Apr 2018, In : Materials Letters. 217, p. 120-127 8 p.

Research output: Contribution to journalArticle

Open Access
File
15 Citations (Scopus)
37 Downloads (Pure)
2017

Effect of pulse electrodeposition on SN-CU coatings for PB-free applications

Cobley, A. J. & Wu, L., 1 Jan 2017, National Association for Surface Finishing Manufacturing and Technology Trade Show and Conference, SUR/FIN 2017. National Association for Surface Finishing, Vol. 1. p. 518-531 14 p.

Research output: Chapter in Book/Report/Conference proceedingConference proceeding

Investigation of Whisker Growth from Alkaline Non-cyanide Zinc Electrodeposits

Wu, L., Ashworth, M. A. & Wilcox, G. D., 1 Feb 2017, In : Journal of Electronic Materials. 46, 2, p. 1114-1127 14 p.

Research output: Contribution to journalArticle

Open Access
File
2 Citations (Scopus)
12 Downloads (Pure)
2015

An Investigation into the Effect of a Post-electroplating Electrochemical Oxidation Treatment on Tin Whisker Formation

Ashworth, M. A., Haspel, D., Wu, L., Wilcox, G. D. & Mortimer, R. J., Jan 2015, In : Journal of Electronic Materials. 44, 1, p. 442-456 15 p.

Research output: Contribution to journalArticle

5 Citations (Scopus)

The role of nodules in the growth of Zn whiskers from alkaline cyanide-free Zn electrodeposits

Wu, L., Ashworth, M. A. & Wilcox, G. D., 2015, Electrochemical Engineering General Session. 21 ed. Electrochemical Society Inc., Vol. 66. p. 1-9 9 p.

Research output: Chapter in Book/Report/Conference proceedingConference proceeding

Open Access
File
1 Citation (Scopus)
11 Downloads (Pure)

Tin whisker mitigation by means of a postelectroplating electrochemical oxidation treatment

Haspel, D. M., Ashworth, M. A., Wu, L., Wilcox, G. D. & Mortimer, R. J., 2015, In : Transactions of the Institute of Metal Finishing. 93, 6, p. 332-341 10 p.

Research output: Contribution to journalArticle

Open Access
File
2 Citations (Scopus)
6 Downloads (Pure)

Zinc whisker growth from electroplated finishes – a review

Wu, L., Ashworth, M. A. & Wilcox, G. D., 1 Apr 2015, In : Transactions of the IMF. 93, 2, p. 1-8 8 p.

Research output: Contribution to journalReview article

Open Access
File
3 Citations (Scopus)
4 Downloads (Pure)