Andrew Cobley

Andrew Cobley

Prof, Dr

    Calculated based on number of publications stored in Pure and citations from Scopus
    20012024

    Research activity per year

    If you made any changes in Pure these will be visible here soon.
    Filter
    Patent

    Search results

    • 2017

      Material Deposition in a Magnetic Field

      Cobley, A. J. & Danilova, S., 13 Jul 2017, IPC No. C23C 18/16, C23C 18/18, C23C 18/20, C23C 18/30, B81C 1/00, Patent No. WO2017118853A2, 5 Jan 2017, Priority date 6 Jan 2016, Priority No. GB1600214.9

      Research output: Patent

    • 2016

      A plain bearing with composite interplayer

      Zhang, Y., Pal, M., Burmistroviene, G., Kerr, I., Montes, I. T., Cobley, A. & Mason, T., 24 Feb 2016, IPC No. F16C 33/12 , F16C 33/14, Patent No. GB2529384A, 23 Jun 2014, Priority date 23 Jun 2014, Priority No. GB20140011143A

      Research output: Patent

    • Bismuth-based composite coating for overlay applications in plain bearings

      Ignacio, T., Yi, Z., Madan, P., Cobley, A. & Kerr, I., 20 Jul 2016, IPC No. C25D 5/20, C22C 12/00, C25D 5/22, F16C 33/12, C25D 7/10, Patent No. GB2534120A, 28 Nov 2014, Priority date 28 Nov 2014, Priority No. GB20140021180.9A

      Research output: Patent

    • 2015

      A plain bearing with improved interlayer

      Tudela, I., Zhang, Y., Pal, M., Cobley, A. J., Burmistroviene, G. & Kerr, I., 2015, Patent No. 1411143.9

      Research output: Patent

    • 2014

      Plating bath and method for depositing a metal layer on a substrate

      Cobley, A. J., Kapeckas, M. J., Reddington, E., Sonnenberg, W., Barstad, L. R. & Buckley, T., 27 Feb 2014, IPC No. C25D 3/02, C25D 3/04, C25D 3/12, C25D 3/22, C25D 3/26, C25D 3/34, C25D 3/38, C25D 3/48, C25D 3/50, C25D 3/56, Patent No. JP2014037634A, 18 Oct 2013, Priority date 2 Oct 2001, Priority No. US20010970348

      Research output: Patent

    • 2013

      Electroless copper and redox couple

      POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 22 Aug 2013, IPC No. H05K 3/42, C23C 18/40, H05K3/18, Patent No. JP2013163867A, 16 May 2013, Priority date 7 Jul 2006, Priority No. US20060819250P

      Research output: Patent

    • Formaldehyde free electroless copper composition

      POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 25 Apr 2013, IPC No. C23C 18/40, Patent No. JP2013076171A, 23 Jan 2013, Priority date 7 Jul 2006, Priority No. US20060819249P

      Research output: Patent

    • 2009

      Electroless methods

      POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & BASS, KEVIN., 1 Jan 2009, IPC No. B05D 7/22, Patent No. US2009004382, 29 Jun 2007, Priority date 29 Jun 2007, Priority No. US20070824222

      Research output: Patent

      Open Access
    • 2008

      Electroless copper and redox couples

      POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Mar 2008, IPC No. H05K 3/18 , C23C 18/38, C23C 18/40, Patent No. TW200813253A, 2 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819250P

      Research output: Patent

      Open Access
    • Electroless copper compositions

      POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 14 Feb 2008, IPC No. C09D 5/00 , H05K 3/00, Patent No. US2008038452A1, 6 Jul 2007, Priority date 6 Jul 2007, Priority No. US20070825379

      Research output: Patent

      Open Access
    • Electroless Copper Plating Bath And Redox Couple

      Poole, M. A., Cobley, A., Singh, A. & Hirst, D. V., 1 May 2008, IPC No. H05K 3/18, C23C 18/40, Patent No. JP2008101268A, 6 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819250P

      Research output: Patent

      Open Access
    • Environmentally friendly electroless copper composition

      POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 24 Jul 2008, IPC No. H05K 3/42 , H05K 3/18, C23C 18/40, Patent No. JP2008169465A, 6 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819246P

      Research output: Patent

      Open Access
    • Environmentally friendly electroless copper compositions

      POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Mar 2008, IPC No. C23C 18/38, C23C 18/40, Patent No. TW200813255A, 5 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819246P

      Research output: Patent

    • Formaldehyde free electroless copper compositions

      POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Feb 2008, IPC No. H05K 3/42 , C23C 18/38, Patent No. TW200809004A, 2 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819249P

      Research output: Patent

      Open Access
    • Improved Electroless Copper Composition

      POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 29 May 2008, IPC No. H05K 3/42, C23C 18/40, H05K3/18, Patent No. JP2008121106A, 6 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819247P

      Research output: Patent

      Open Access
    • Improved electroless copper compositions

      POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Mar 2008, IPC No. H05K 3/18 , C23C 18/40, Patent No. TW200813254A, 5 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819247P

      Research output: Patent

      Open Access
    • 2004

      Desmear and texturing method

      Cobley, A., Goosey, M. T. & Poole, M. A., 1 Nov 2004, IPC No. H05K 3/00, H05K3/42, C08J 7/16, Patent No. TW200422331A, 5 Nov 2003, Priority date 28 Oct 2002, Priority No. GB20020025012A

      Research output: Patent

    • Method For Desmearing Resin Accretions And Texturing Resin Without Using Solvent

      COBLEY ANDREW, J., GOOSEY MARTIN, T. & POOLE MARK, A., 8 May 2004, IPC No. H05K 3/00, H05K 3/42, C08J 7/16, Patent No. KR20040038728A, 28 Oct 2003, Priority date 28 Oct 2002, Priority No. GB20020025012

      Research output: Patent

      Open Access
    Your message has successfully been sent.
    Your message was not sent due to an error.