Andrew Cobley

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Andrew Cobley

Prof, Dr

 https://orcid.org/0000-0002-6722-0740
    Calculated based on number of publications stored in Pure and citations from Scopus
    20012024

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    • 2017

      Material Deposition in a Magnetic Field

      Cobley, A. J. & Danilova, S., 13 Jul 2017, IPC No. C23C 18/16, C23C 18/18, C23C 18/20, C23C 18/30, B81C 1/00, Patent No. WO2017118853A2, 5 Jan 2017, Priority date 6 Jan 2016, Priority No. GB1600214.9

      Research output: Patent

    • 2016

      A plain bearing with composite interplayer

      Zhang, Y., Pal, M., Burmistroviene, G., Kerr, I., Montes, I. T., Cobley, A. & Mason, T., 24 Feb 2016, IPC No. F16C 33/12 , F16C 33/14, Patent No. GB2529384A, 23 Jun 2014, Priority date 23 Jun 2014, Priority No. GB20140011143A

      Research output: Patent

    • Bismuth-based composite coating for overlay applications in plain bearings

      Ignacio, T., Yi, Z., Madan, P., Cobley, A. & Kerr, I., 20 Jul 2016, IPC No. C25D 5/20, C22C 12/00, C25D 5/22, F16C 33/12, C25D 7/10, Patent No. GB2534120A, 28 Nov 2014, Priority date 28 Nov 2014, Priority No. GB20140021180.9A

      Research output: Patent

    • 2015

      A plain bearing with improved interlayer

      Tudela, I., Zhang, Y., Pal, M., Cobley, A. J., Burmistroviene, G. & Kerr, I., 2015, Patent No. 1411143.9

      Research output: Patent

    • 2014

      Plating bath and method for depositing a metal layer on a substrate

      Cobley, A. J., Kapeckas, M. J., Reddington, E., Sonnenberg, W., Barstad, L. R. & Buckley, T., 27 Feb 2014, IPC No. C25D 3/02, C25D 3/04, C25D 3/12, C25D 3/22, C25D 3/26, C25D 3/34, C25D 3/38, C25D 3/48, C25D 3/50, C25D 3/56, Patent No. JP2014037634A, 18 Oct 2013, Priority date 2 Oct 2001, Priority No. US20010970348

      Research output: Patent

    • 2013

      Electroless copper and redox couple

      POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 22 Aug 2013, IPC No. H05K 3/42, C23C 18/40, H05K3/18, Patent No. JP2013163867A, 16 May 2013, Priority date 7 Jul 2006, Priority No. US20060819250P

      Research output: Patent

    • Formaldehyde free electroless copper composition

      POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 25 Apr 2013, IPC No. C23C 18/40, Patent No. JP2013076171A, 23 Jan 2013, Priority date 7 Jul 2006, Priority No. US20060819249P

      Research output: Patent

    • 2009

      Electroless methods

      POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & BASS, KEVIN., 1 Jan 2009, IPC No. B05D 7/22, Patent No. US2009004382, 29 Jun 2007, Priority date 29 Jun 2007, Priority No. US20070824222

      Research output: Patent

      Open Access
    • 2008

      Electroless copper and redox couples

      POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Mar 2008, IPC No. H05K 3/18 , C23C 18/38, C23C 18/40, Patent No. TW200813253A, 2 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819250P

      Research output: Patent

      Open Access

    • Electroless copper compositions

      POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 14 Feb 2008, IPC No. C09D 5/00 , H05K 3/00, Patent No. US2008038452A1, 6 Jul 2007, Priority date 6 Jul 2007, Priority No. US20070825379

      Research output: Patent

      Open Access

    • Electroless Copper Plating Bath And Redox Couple

      Poole, M. A., Cobley, A., Singh, A. & Hirst, D. V., 1 May 2008, IPC No. H05K 3/18, C23C 18/40, Patent No. JP2008101268A, 6 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819250P

      Research output: Patent

      Open Access

    • Environmentally friendly electroless copper composition

      POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 24 Jul 2008, IPC No. H05K 3/42 , H05K 3/18, C23C 18/40, Patent No. JP2008169465A, 6 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819246P

      Research output: Patent

      Open Access

    • Environmentally friendly electroless copper compositions

      POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Mar 2008, IPC No. C23C 18/38, C23C 18/40, Patent No. TW200813255A, 5 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819246P

      Research output: Patent

    • Formaldehyde free electroless copper compositions

      POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Feb 2008, IPC No. H05K 3/42 , C23C 18/38, Patent No. TW200809004A, 2 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819249P

      Research output: Patent

      Open Access

    • Improved Electroless Copper Composition

      POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 29 May 2008, IPC No. H05K 3/42, C23C 18/40, H05K3/18, Patent No. JP2008121106A, 6 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819247P

      Research output: Patent

      Open Access

    • Improved electroless copper compositions

      POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Mar 2008, IPC No. H05K 3/18 , C23C 18/40, Patent No. TW200813254A, 5 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819247P

      Research output: Patent

      Open Access
    • 2004

      Desmear and texturing method

      Cobley, A., Goosey, M. T. & Poole, M. A., 1 Nov 2004, IPC No. H05K 3/00, H05K3/42, C08J 7/16, Patent No. TW200422331A, 5 Nov 2003, Priority date 28 Oct 2002, Priority No. GB20020025012A

      Research output: Patent

    • Method For Desmearing Resin Accretions And Texturing Resin Without Using Solvent

      COBLEY ANDREW, J., GOOSEY MARTIN, T. & POOLE MARK, A., 8 May 2004, IPC No. H05K 3/00, H05K 3/42, C08J 7/16, Patent No. KR20040038728A, 28 Oct 2003, Priority date 28 Oct 2002, Priority No. GB20020025012

      Research output: Patent

      Open Access
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