Research Output per year
Research Output 1990 2019
2009
Electroless methods
POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & BASS, KEVIN., 1 Jan 2009, IPC No. B05D 7/ 22 A I, Patent No. US2009004382, Priority date 29 Jun 2007, Priority No. US20070824222Research output: Patent
Open Access
Adsorption
Catalysts
Metallizing
Printed circuit boards
2008
Electroless copper and redox couples
POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Mar 2008, IPC No. H05K 3/ 18 A I, Patent No. TW200813253, Priority date 7 Jul 2006, Priority No. US20060819250PResearch output: Patent
Open Access
copper
formaldehyde
substrate
Electroless copper compositions
POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 14 Feb 2008, IPC No. C09D 5/ 00 A I, Patent No. US2008038452, Priority date 6 Jul 2007, Priority No. US20070825379Research output: Patent
Open Access
Copper alloys
Copper
Chemical analysis
Plating
Formaldehyde
ENVIRONMENTALLY FRIENDLY ELECTROLESS COPPER COMPOSITION
POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 24 Jul 2008, IPC No. H05K 3/ 42 A I, Patent No. JP2008169465, Priority date 7 Jul 2006, Priority No. US20060819246PResearch output: Patent
Open Access
copper
glyoxylic acid
acids
formaldehyde
ions
Environmentally friendly electroless copper compositions
POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Mar 2008, IPC No. C23C 18/ 38 A I, Patent No. TW200813255, Priority date 7 Jul 2006, Priority No. US20060819246PResearch output: Patent
Open Access
Copper
Copper alloys
Chemical analysis
Plating
Formaldehyde
Formaldehyde free electroless copper compositions
POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Feb 2008, IPC No. H05K 3/ 42 A I, Patent No. TW200809004, Priority date 7 Jul 2006, Priority No. US20060819249PResearch output: Patent
Open Access
Copper alloys
Formaldehyde
Copper
Chemical analysis
Plating
IMPROVED ELECTROLESS COPPER COMPOSITION
POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 29 May 2008, IPC No. H05K 3/ 42 A I, Patent No. JP2008121106, Priority date 7 Jul 2006, Priority No. US20060819247PResearch output: Patent
Open Access
Copper plating
Electroless plating
Copper
Fructose
Reducing agents
Improved electroless copper compositions
POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Mar 2008, IPC No. H05K 3/ 18 A I, Patent No. TW200813254, Priority date 7 Jul 2006, Priority No. US20060819247PResearch output: Patent
Open Access
Copper alloys
Copper
Chemical analysis
Plating
Formaldehyde