Effect of pulse plating techniques in electrodeposited Sn-Cu Coatings for Pb-free, environmentally-friendly applications

Wu, L. (Speaker), Cobley, A. (Speaker)

Activity: Talk or presentationOral presentation

Period11 Sep 2017 - 12 Sep 2017
Held atUniversity of Birmingham, United Kingdom
Degree of RecognitionInternational

Keywords

  • Electrodeposition
  • Tin Copper
  • alloy coatings
  • Pulse plating
  • Lead-free